Job Details

About the Company: A semiconductor adhesive materials company seeking expertise in the technical and application areas described in this position. The role offers a focused setting for translating specialist knowledge into research, engineering or organizational outcomes.

Target Candidates: PhD in Polymers, Chemistry, Adhesives, UV-Curable Materials or Semiconductor Materials.

Responsibilities

•  Develop adhesives for semiconductor wafer grinding and dicing, particularly UV-curable products.

•  Design formulations, optimize properties and validate performance in customer applications.

•  Resolve adhesion, release, residue, chemical resistance and stability issues in wafer processing.

•  Plan experiments, analyze data and support samples, production introduction and customer problem-solving.

•  The position links formulation or process research with characterization, scale-up and application requirements. The project should be advanced using reproducible experiments, measurable material performance and clear records of processing conditions.

•  Translate the stated responsibilities into clear work plans, review interim results against project objectives, and communicate progress, technical risks and next steps to the relevant team. Carry lessons from testing or implementation into the following development cycle.

Requirements

•  PhD in Polymers, Chemistry, Adhesives, UV-Curable Materials or Semiconductor Materials.

•  At least eight years in UV curing and familiarity with adhesive formulation, photopolymerization and wafer grinding/dicing applications.

•  Senior R&D experience and customer-qualification capability in relevant materials companies preferred.

•  Candidates should analyze structure–property or process–performance relationships and communicate findings to research, production, quality and application teams.

Highlights & Support: Semiconductor processing adhesive R&D for UV curing and wafer grinding/dicing applications.