Job Details

About the Company: A implantable medical device company seeking expertise in the technical and application areas described in this position. The role offers a focused setting for translating specialist knowledge into research, engineering or organizational outcomes.

Target Candidates: Master’s degree or above in IC Design, Microelectronics, Electronics or Biomedical Engineering.

Responsibilities

•  Define chip-level requirements and analog architecture for implantable medical electronics.

•  Design power domains, analog/digital interfaces, high-voltage stimulation drivers, sources and programmable switches.

•  Develop low-noise neural-signal acquisition AFE chains, including instrumentation amplifiers, PGA and ADC.

•  Lead simulation, DRC/LVS/ERC and layout-quality review, tape-out, bring-up, test and production introduction.

•  The position spans design choices, implementation and verification within the semiconductor development workflow. Technical decisions should be traceable to measurable performance, process or reliability targets in the products and projects described below.

Requirements

•  Master’s degree or above in IC Design, Microelectronics, Electronics or Biomedical Engineering.

•  At least five years of analog IC or mixed-signal ASIC design; implantable/medical-grade, low-power, high-reliability experience preferred.

•  High-voltage circuits, neural AFE, ADC/PGA, PVT/Monte Carlo/noise/drift verification, layout supervision and silicon debug.

•  Candidates should bring disciplined design reviews, test interpretation and problem resolution, together with clear communication across design, process, packaging and application interfaces where relevant.

Highlights & Support: Annual compensation: RMB 700,000–980,000; core DBS and implantable-device IC development.