Job Details

About the Company: A chip company focusing on high-performance RF front-end chips, with products covering 5G, Wi-Fi 6/7, and automotive electronics.

Target Candidates: Senior design professionals in RF power amplifiers, mmWave chips, PA modules, LNAs, switches, filters, and RF front-end modules.

Responsibilities

•  Lead RF, microwave, and mmWave chip design — covering VCO, LNA, PA, attenuator, phase shifter, mixer, filter, and other modules.

•  Complete related product design, simulation, verification, debugging, joint debugging, and problem localization — supporting layout design and tapeout.

•  Lead design document completeness, archiving, and R&D process standardization — improving product development quality and traceability.

•  Participate in lab testing, process evaluation, device selection, and passive device design — driving RF front-end product engineering and mass production.

Requirements

•  Degree in Semiconductor Physics, Microelectronics, Electronic Engineering, Communication Engineering, or a related field, with 10+ years of RF PA chip design experience.

•  Familiar with microwave RF, EM fields, analog circuits, signals & systems, and communication systems.

•  Familiar with CMOS, SOI, GaAs, GaN, SiGe, and other semiconductor processes — with EM simulation, layout design, and circuit test analysis capability.

•  Complete PA Module/LNA/Switch product development experience, familiar with network analyzers, spectrum analyzers, signal sources, comprehensive testers, probe stations, etc, is preferred.

Highlights & Support: Focused on RF front-end core chips and module domestic substitution — combining high technical barriers, mass-production challenges, and 5G/automotive electronics application scenarios.