Job Details

About the Company: A high-tech company specializing in artificial intelligence. It is recruiting overseas high-level talent across Cluster Deployment Resource Management (Container) Software Lead, Senior PA Engineer and related areas.

Target Candidates: Overseas master's/PhD graduates or senior experts in semiconductor chips, AI acceleration, EDA, hardware architecture, and embedded systems

Responsibilities

    •  Lead the architecture design and development of compilers for high-performance AI chips, building efficient compilation paths from deep-learning frameworks to chip instructions.

    •  Lead intra-super-node communication stack development, including the architecture, development, and optimization of low-level communication software based on in-house chip interconnect technologies (e.g., OISA, UAIink, ETH-X).

    •  Lead intra-super-node communication-stack development: own the architecture design, development, and optimization of the low-level communication software stack based on in-house chip-interconnect technologies (e.g., OISA, UAIink, ETH-X).

     •  Lead the R&D team and be responsible for the technical planning and software architecture design of resource management for self-developed chip boards/cards.

Requirements

    •  Familiar with verification flows, with SoC or complex IP verification experience.

    •  Familiar with robotics systems and AI perception/control tasks, with embedded deployment experience preferred.

    •  Master's or PhD degree, or equivalent senior technical expertise, in a relevant field.

    •  Relevant expertise in semiconductor chips, AI acceleration, EDA, hardware architecture, and embedded systems.

Highlights & Support: This recruitment covers approximately 21 positions with compensation of above RMB 1M and RMB 500K–1M/year. Specific position level, compensation, and support terms can be further negotiated based on the candidate's academic background, project experience, commercialization achievements, and interview results.